Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第22卷    第1期    总第154期    2012年1月

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文章编号:1004-0609(2012)1-0007-08
二次加热过程中半固态AZ31镁合金的显微组织演变
曹富荣1,管仁国1,陈礼清2,赵占勇1,任  勇2

(1. 东北大学 材料与冶金学院,沈阳 110004;
2. 东北大学 轧制技术及连轧自动化国家重点实验室,沈阳110004
)

摘 要: 利用波浪形倾斜板振动技术制备AZ31镁合金半固态坯料,获得较为理想的球形或近球形晶粒组织。结果表明:随二次加热温度的升高和保温时间的延长,半固态组织中的液相体积分数增大, 固相逐渐长大并球化;AZ31镁合金580 ℃和610 ℃时二次加热组织均不适合半固态触变成形;适合触变成形的二次加热最优工艺为590 ℃保温40~60 min、或者600 ℃保温30 min;此条件下获得的平均晶粒直径为58~61 μm,固相率为87%(体积分数)左右。晶格扩散机制对二次加热原子扩散起主导作用,是造成合金固相颗粒尺寸变化的根本原因;固液界面张力是造成颗粒形状球形或近球形变化的重要原因。

 

关键字: AZ31镁合金;半固态;倾斜板;二次加热;显微组织

Microstructure evolution of
semisolid AZ31 magnesium alloy during reheating process
CAO Fu-rong1, GUAN Ren-guo1, CHEN Li-qing2, ZHAO Zhan-yong1, REN Yong2

1. School of Materials and Metallurgy, Northeastern University, Shenyang 110004, China;
2. The State Key Laboratory of Rolling and Automation, Shenyang 110004, China

Abstract:AZ31 magnesium semisolid billets were prepared by a self-designed wavelike vibration sloping plate device, and an ideal globular or near-globular microstructure can be obtained by wavelike vibration sloping plate technique. The results show that, with the increase of reheating temperature and the prolongation of holding time, the liquid fraction in semisolid microstructure increases, and the solid phase grows gradually and spheroidises. The reheating microstructures at 580 ℃ and 610 ℃ are not suitable for thixoforming. The optimum reheating process parameters suitable for thixoforming are 590 ℃ for 40−60min or 600 ℃ for 30 min, under which the average grain diameter is 58−61 μm and solid fraction is about 87%. The lattice diffusion resulting in the variation of grain size is the dominant atomic diffusion mechanism of reheating. The solid-liquid interfacial tension results in the variation of globular or near-globular shape.

 

Key words: AZ31 magnesium alloy; semisolid; sloping plate; reheating; microstructure

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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